Thickened Thermal Conductive Silica Gel Pad Size: 10x10x6MM
Introducing our Thickened Thermal Conductive Silica Gel Pad, designed to facilitate excellent thermal conductivity between IC components and heatsinks. Boasting softness and elasticity, these thermal pads conform effectively to irregular surfaces, ensuring comprehensive coverage.
These pads efficiently transfer heat from internal devices to metal shells or heatsink plates, thereby enhancing the efficiency and extending the service life of heating electronic components. Trust in our thermal pads to optimize thermal management and maintain the reliability of your electronic systems.
Note:
- The actual image may vary in terms of Product dimension
- Actual Product Vary form the image
Feature:
- Thermal Conductive Silica Gel Pad
- 6.0 W/mK thermal conductivity for fast heat transferring in a short time.
- High temperature performance in -40 ℃ – 200 ℃ will not melt.
- Contact with any electrical traces wouldn’t result in damage of any sort.
- Non-toxic, odorless, anti-corrosion, wear-resistant, anti-static, fire retardant, compression, good insulation.
Specification:
- Product: Thermal Conductive Silica Gel Pad
- Product type: Thermal Insulator Gel pad
- Operating Temperature: -40 ℃ – 200 ℃ will not melt
- Color: Color of Actual Product Can vary from given Image
- Size: 10x10x6MM
Package Includes:
1 x Thickened Thermal Conductive Silica Gel Pad