PCB Capabilities & Specifications

PCB Manufacturing Capabilities

Via Covering Options

• Tented: Vias covered with solder mask on both sides (default, recommended)
• Untented: Vias left open/exposed
• Plugged: Vias filled with solder mask material
• Epoxy Filled: Vias filled with non-conductive epoxy and capped
• Copper-Epoxy Filled: Epoxy filled and copper plated over (for HDI)

Base Materials

• FR-4: Standard glass-reinforced epoxy laminate (most common)
• Aluminum: Metal-core PCB for LED and high-power applications
• Copper Core: Superior thermal conductivity for power electronics
• Rogers: High-frequency laminate for RF applications
• PTFE (Teflon): Ultra-low loss for microwave circuits
• Flex (FPC): Flexible polyimide substrate

PCB Dimensions

• Minimum size: 5mm × 5mm
• Maximum size: 500mm × 1100mm (varies by layer count)
• Dimension tolerance: ±0.2mm

Copper Weight Guide

Surface Finish Options

• HASL (with lead): Hot Air Solder Leveling — economical, good solderability
• Lead-free HASL: RoHS compliant version
• ENIG: Electroless Nickel Immersion Gold — flat pads, excellent for BGA/QFP

Gold Fingers

Edge connector fingers with hard gold plating. Available with 30° or 45° beveling. Minimum finger width: 0.5mm, minimum spacing: 0.5mm.

FR-4

Aluminum

Copper core

Rogers

PTFE

Flex

Tented via

Untented via

Plugged via

Epoxy filled via

Castellated Holes (Half-Holes)

Plated half-holes on board edges for module-to-PCB connections. Minimum hole diameter: 0.6mm.

Multi-Layer Stack-up

Standard laminated structures available for 4, 6, 8, 10, 12, 14, and 16 layer boards. Custom stack-ups available on request.

Mark on PCB

Order number mark

QR code mark

• No marking: No order number on PCB
• Customer code: Order number placed at manufacturer’s discretion
• Specified location: You designate where the marking goes
• Serial QR: Unique QR code on each board for traceability