Instructions for PCB Orders
1. Solder-Resistance Bridges
For solder-resistance bridges, spacing between pads/pins requires at least 0.2mm on 1-2 layer boards and 0.1mm on multilayer boards. Please add a note like “solder mask bridge is required” when ordering.
2. File Format Priority
Only Gerber files are processed. English descriptions, PDFs, DXF, Excel, and other non-Gerber files in your ZIP will be disregarded. If both PCB files and Gerber files exist, the Gerber file takes precedence.
3. Plated Slots
Minimum plated slot width is 0.5mm, with length at least twice the width. Rectangular slots without rounded corners are unsupported. For edge plating, include a picture in the Gerber file and mention it in remarks.
4. Board Outline & Slots
V-cut lines, cutouts, millings and slots must be in the same layer as the board outline. If not in the same layer, they will be missed. Design thickness of 0.15mm is recommended for outlines.
5. Silkscreen / Text Requirements
- Minimum text width: 0.15mm
- Minimum text height: 1mm
- Preferred width-to-height ratio: 1:6
- Outline fonts with filled lines need 0.15mm minimum line width
- When silkscreen overlaps with solder mask openings, openings take priority
6. Multi-Layer PCBs
Three-layer PCBs are not manufactured. If you need an odd inner layer, it will be processed as the next even layer count (e.g., 3 layers → 4 layers).
7. Panelization
We support V-cut panelization for rectangular and round shapes only. If self-panelized but ordered as “Single PCB,” the number of unique designs must not exceed 5. For “Panel by Customer,” designs must not exceed 10.
8. Small Boards (≤50mm × 50mm)
Milling small boards perfectly is challenging. We recommend panelizing small boards for better results and handling.
9. Solder Mask Layer
The solder mask layer is a required layer. If absent or blank, the board defaults to full solder mask coverage. Design your solder mask openings correctly.
10. Remarks Field
A remark field exists for important information, but orders with English notes may take longer processing time. Use this sparingly.
11. Gerber Preview
The website preview is only for quick review before payment. It may not display your design exactly as intended — always verify your files independently.
Instructions for Stencil Orders
1. Solder Paste Layer
The stencil is made based on the paste layer. Ensure it contains all required elements. To avoid questions about differences between solder mask and paste layers, add a remark: “Please follow the solder paste layer only.”
2. Aperture Processing
IC, BGA, and 0805+ capacitor/resistor footprints are processed with standard aperture reduction by default. For exact paste layer matching, leave a remark requesting exact matching.
3. Stencil Thickness
Standard free thicknesses: 0.1, 0.12, 0.15, 0.18, 0.2mm. Special thicknesses (0.03-0.5mm) are available at additional cost.
4. Valid Area
For frame stencils, the valid area is within the adhesive tape. For non-frame stencils, approximately 8mm on each side is excluded for clamping.
5. Fiducials
Select “Etched Through” or “Etched Half” and include fiducial designs in your paste layer file.
6. Top+Bottom on Single Stencil
This option requires the stencil valid area to be larger than double the PCB size. Ensure your selected stencil size is large enough.
7. Packaging
- Non-frame stencils under 25×25cm: plastic bags then flight cases
- Over 25×25cm: wood plates and cardboard boxes
- Frame stencils: cardboard boxes with wood plate protection
